Method for manufacturing semiconductor device comprising cobalt

Fishing – trapping – and vermin destroying

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437192, 437195, 437201, 437239, H01L 21283

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055676529

ABSTRACT:
A method for manufacturing a semiconductor device which comprises a silicon single crystal substrate and a cobalt silicide film formed on the silicon single crystal substrate and equipped with a matched crystalline orientation reflecting the crystallinity of the silicon substrate. The present invention also discloses a method for manufacturing a desired semiconductor device comprising a substantially epitaxial and less uneven cobalt silicide film which comprises forming a Si oxide film on the surface of a Si substrate, further forming Ti and Co films, followed by heat treatment. This method provides a convenient process along with a cobalt silicide film which is less uneven in its surface and is excellent in crystal orientation can be selectively formed, and an effect that a contact can be formed which is less uneven and has a low contact resistance.

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"Nanoscal CoSi.sub.2 Contact Layer Growth From Deposited Co/Ti Multilayers on Si Substrates"; Hong et al; Appl. Phys. Lett. 61(13), Sep. 28, 1992; pp. 1519-1521.
"Epitaxial Growth of CoSi.sub.2 on Both (111) and (100) Si Substrates by Multistep Annealing of a ternary Co/Ti/Si System": Liu et al; J. Appl. Phys. 74(3), Aug. 1, 1993; pp. 1700-1706.
"Resistance and Structural Stabilities of Epitaxial CoSi.sub.2 Films on (001) Si Substrates": Hsia et al; J. Appl. vol 72, No. 5; Sep. 1, 1992; pp. 1864-1873.
"Formation of Epitaxial CoSi.sub.2 Films on (001) Silicon Using Ti-Co Alloy and Bimetal Source Materials"; Hsia et al; J. Appl. Phys. vol. 70, No. 12; Dec. 15, 1991; pp. 7579-7587.
Ghandhi, S. K., VLSI Fabrication Principles, John Wiley & Sons, 1983, PP. 371-375.

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