Method for manufacturing semiconductor device and polisher...

Details Method for manufacturing semiconductor device and polisher... Method for manufacturing semiconductor device and polisher...

2008-01-03

2010-11-30

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

C451S028000, C216S089000, C257SE21230

Reexamination Certificate

active

07842614

ABSTRACT:
A method for manufacturing a semiconductor device, including depositing an interconnect material including Cu or Cu alloy over an insulating film, and polishing the interconnect material by CMP with a polishing liquid, wherein the oxidation-reduction potential (ORP) of the polishing liquid is controlled so as to be in the range of 400 mV to 700 mV vs. Ag/AgCl.

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