Method for manufacturing semiconductor device and exposure...

Details Method for manufacturing semiconductor device and exposure... Method for manufacturing semiconductor device and exposure...

2006-07-18

2006-07-18

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Distortion introducing or rectifying

C355S055000

Reexamination Certificate

active

07079219

ABSTRACT:
A method for manufacturing a semiconductor device, including obtaining a first dimension difference or ratio which shows a dimension difference or ratio of a latent images of a first and a second focus monitor marks, or a dimension difference or ratio of a first and a second focus monitor marks, calculating a first defocus value based on the first dimension difference or ratio, obtaining second characteristic showing defocus value characteristic for a pressure inside a chamber based on pairs of the pressure and defocus value, measuring the pressure, predicting the defocus value based on the measured pressure and the second characteristic, correcting the relationship between a focus position of an exposure light and a position on the optical axis of the second resist film in accordance with the predicted defocus value, and forming the latent image of the circuit pattern on the second photo resist film.

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patent: 10-289865 (1998-10-01), None

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