Method for manufacturing semiconductor device and apparatus for

Details Method for manufacturing semiconductor device and apparatus for Method for manufacturing semiconductor device and apparatus for

1998-10-14

1999-12-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438124, 438126, H01L 2144

Patent

active

059982438

ABSTRACT:
In a method for manufacturing a flip-chip bonded semiconductor device is used an apparatus for resin-encapsulating, the apparatus which comprises a molding die consisting of a plurality of mold bodies, device for decompressing cavities of the molding die, device for heating the molding die, and device for injecting a liquid resin under pressure into the cavities, to form a resin-encapsulating layer by transfer molding. A bonded body having a semiconductor chip connected to a wiring substrate through its bumps is placed in the cavities of the molding die, the cavities are heated and decompressed, then the liquid resin is injected under pressure into the cavities through a gate to form a resin-encapsulating layer. Thus, the molding resin can be filled uniformly into the gap between the semiconductor chip and the wiring substrate in a short time to produce a flip-chip bonded semiconductor device having good performances.

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patent: 5874324 (1999-02-01), Osada

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