Method for manufacturing semiconductor device, and...

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S381000, C257SE21009

Reexamination Certificate

active

11155031

ABSTRACT:
A first hydrogen barrier film and an intermediate layer are formed on an interlayer dielectric film. A ferroelectric capacitor is formed on the intermediate layer, and a second hydrogen barrier film is formed over the entire surface including on the upper surface and side surfaces of the ferroelectric capacitor and on the intermediate layer. Then, the second hydrogen barrier film and the intermediate layer are removed while leaving at least portions on the upper surface and side surfaces of the ferroelectric capacitor. Then, a third hydrogen barrier film is formed on the second hydrogen barrier film, on side surfaces of the second hydrogen barrier film and the intermediate layer, and on the first hydrogen barrier film.

REFERENCES:
patent: 2002-176149 (2002-06-01), None
patent: 2002-299576 (2002-10-01), None
patent: 2003-051582 (2003-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for manufacturing semiconductor device, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device, and... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3798562

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.