Method for manufacturing semiconductor device, adhesive...

Details Method for manufacturing semiconductor device, adhesive... Method for manufacturing semiconductor device, adhesive...

2005-02-22

2005-02-22

Everhart, Caridad (Department: 2825)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S124000, C257S783000

Reexamination Certificate

active

06858473

ABSTRACT:
A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at least one semiconductor element having electrodes to the adhesive layer, wherein an electrode-free side of the semiconductor element is attached to the adhesive layer; (3) electrically connecting a wire between each of the electrically conductive parts and each of the electrodes of the semiconductor element; (4) sealing the semiconductor element in a sealing resin to form a semiconductor device on the adhesive sheet; and (5) separating the adhesive sheet from the semiconductor device. This method enables the production of thin semiconductor devices with a surface mount type.

REFERENCES:
patent: 6475629 (2002-11-01), Takeuchi et al.
patent: 6498392 (2002-12-01), Azuma
patent: 6683298 (2004-01-01), Hunter et al.
patent: 20020146864 (2002-10-01), Miyaki et al.
patent: 20030092253 (2003-05-01), Yamaguchi
patent: 9-252014 (1997-09-01), None
patent: 2001-210743 (2001-08-01), None

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