Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1977-01-07
1979-02-13
Dost, Gerald A.
Metal working
Method of mechanical manufacture
Assembling or joining
B01J 1700
Patent
active
041387813
ABSTRACT:
In a method for the manufacture of a semiconductor device, comprising selectively forming at least one function region of a semiconductor element by a photoengraving technique using a masking layer and forming an electrode metal layer on an electrode contact surface portion of said substrate adjacent to the function region, the position of the electrode contact portion is determined by subjecting the masking layer on the surface of the substrate to an initial patterning step. This method can be advantageously used to attain high integration of an IC device.
REFERENCES:
patent: 3700507 (1972-10-01), Murray
patent: 3707656 (1972-12-01), DeWitt
patent: 3708360 (1973-01-01), Wakefield et al.
patent: 3798752 (1974-03-01), Fujimoto
patent: 3800411 (1974-04-01), Abbink
patent: 3967981 (1976-07-01), Yamazaki
Dost Gerald A.
Tokyo Shibaura Electric Co. Ltd.
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