Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2006-11-28

2009-12-22

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C430S317000, C216S041000, C216S049000, C216S051000, C216S067000, C216S079000, C438S585000, C438S710000

Reexamination Certificate

active

07635649

ABSTRACT:
A method for manufacturing a semiconductor device is provided. The method includes forming a polysilicon layer on a semiconductor substrate, forming an anti-reflection coating on the polysilicon layer, forming a photoresist (PR) layer pattern on the anti-reflection coating, etching the anti-reflection coating using the PR layer pattern as a mask in capacitive coupled plasma (CCP) equipment using CF4, Ar, and O2, so as to cause a reaction by-product generated by etching the anti-reflect coating to be deposited on sidewalls of the PR layer pattern, thereby forming spacers, and etching the polysilicon layer using the PR layer pattern and the spacers as a mask.

REFERENCES:
patent: 5804088 (1998-09-01), McKee
patent: 5976769 (1999-11-01), Chapman
patent: 6010829 (2000-01-01), Rogers et al.
patent: 6300251 (2001-10-01), Pradeep et al.
patent: 6383941 (2002-05-01), Shen et al.
patent: 6432832 (2002-08-01), Miller et al.
patent: 6541843 (2003-04-01), Yin et al.
patent: 6759263 (2004-07-01), Ying et al.
patent: 6893893 (2005-05-01), Nallan et al.
patent: 6949411 (2005-09-01), Mikhaylichenko et al.
patent: 6964928 (2005-11-01), Ying et al.
patent: 7094613 (2006-08-01), Mui et al.
patent: 7105361 (2006-09-01), Chen et al.
patent: 7192878 (2007-03-01), Weng et al.
patent: 7195716 (2007-03-01), Chou
patent: 7229925 (2007-06-01), Kim
patent: 2003/0092281 (2003-05-01), Ramachandramurthy et al.
patent: 2003/0180968 (2003-09-01), Nallan et al.
patent: 2004/0026369 (2004-02-01), Ying et al.
patent: 2004/0029393 (2004-02-01), Ying et al.
patent: 2004/0038436 (2004-02-01), Mori et al.
patent: 2004/0043526 (2004-03-01), Ying et al.
patent: 2004/0043620 (2004-03-01), Ying et al.
patent: 2004/0203242 (2004-10-01), Stojakovic et al.
patent: 2006/0076313 (2006-04-01), Chou
patent: 2006/0276018 (2006-12-01), Nam et al.
patent: 2007/0037396 (2007-02-01), Verhaverbeke
patent: 2007/0042603 (2007-02-01), Kropewnicki et al.
patent: 2007/0054491 (2007-03-01), Chen
patent: 2007/0059937 (2007-03-01), Kang
patent: 2007/0077782 (2007-04-01), Lee et al.
patent: 2007/0082481 (2007-04-01), Jung
patent: 2007/0122753 (2007-05-01), Jang
patent: 2007/0125750 (2007-06-01), Weng et al.
patent: 10-2001-0048887 (2003-02-01), None
patent: 2004-065034 (2004-07-01), None

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