Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Patent
1998-12-02
2000-08-29
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
438 22, 438106, 438127, H01L 2100
Patent
active
061107557
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method for producing semiconductor devices, and particularly to a method for efficiently producing reliable semiconductor devices, using a large-sized circuit board from which a plurality of individual boards can be obtained.
BACKGROUND ART
A resin encapsulated semiconductor device, for example, of a BGA (Ball Grid Array) type using a resinous substrate of a printed circuit board or others, is provided while encapsulating a semiconductor chip with a resin through a potting method or by using a resin-encapsulating mold. The potting method is advantageous because of its ease of execution and its application to a large-sized-resinous substrate used for simultaneously forming a plurality of individual circuit boards. On the other hand, the method using the resin-encapsulating mold is advantageous because it has a shorter cycle time to facilitate productivity.
In the prior art, encapsulating is carried out by the potting method after a semiconductor chip 12 has been die-bonded to a substrate 10, and electrically connected to a circuit pattern by wire-bonding or the like, wherein a dam 14 is formed with a resin having a shape-retention property around the periphery or an area to be encapsulated and a encapsulating resin 16 is injected into the interior of the dam 14. In such a manner, according to the prior art method for producing a semiconductor device while encapsulating the same by the potting method, it is necessary to form the dam 14 around the area to be encapsulated, which results in a problem in that a package size becomes larger by the dam space. Also, when a large-sized resinous substrate is used, from which a plurality of individual boards are to be obtained, the dam 14 must be formed in the respective packages, whereby fewer packages are obtainable from this resinous substrate.
When the individual semiconductor device is obtained by mounting semiconductor chips on a large-sized substrate, resin-encapsulating the same and separating the respective packages from large-sized substrate, the lateral surface of the separated substrate 10 is exposed outside as shown in FIG. 8, from which the moisture is liable to be absorbed to lower the reliability of the package, especially if the substrate is made of resin.
DISCLOSURE OF THE INVENTION
An object of a method for producing a semiconductor device according to the present invention relates to a method for obtaining products by encapsulating one surface of a substrate mounting semiconductor chips thereon, such as a BGA type, capable of minimizing a package size and increasing the number of products obtained from a large-sized substrate as well as resulting in a reliable semiconductor device.
To achieve the above-mentioned object, the present invention has the following constituent features:
That is, according to the present invention, a method for producing semiconductor devices, each comprising a semiconductor chip mounted on a substrate and encapsulated with resin, is provided, said method comprising the steps of: mounting a semiconductor chip on each of the unit substrates formed in a large-sized substrate to be sectioned by slits arranged along a contour of the unit substrate while leaving a connecting area between the adjacent unit substrates; laminating a tape for preventing the encapsulating resin from flowing out from the slits on a surface of the large-sized substrate opposite to that mounting the semiconductor chips thereon; resin-encapsulating the semiconductor chip by filling a encapsulating resin into an area of the surface mounting the semiconductor chip thereon defined inside of the outer periphery of the large-sized substrate; and cutting the large-sized substrate thus resin-encapsulated into individual unit substrates together with the encapsulating resin to obtain individual resin-encapsulated semiconductor devices.
The step of resin-encapsulating the semiconductor chip may be carried out by providing a dam for inhibiting the flow-out of the encapsulating resin on the outer periphery
REFERENCES:
patent: 5614443 (1997-03-01), Nakashima et al.
patent: 5684327 (1997-11-01), Nakazawa et al.
Miyagawa Hiroshi
Muramatsu Shigetsugu
Collins D. M.
Picardat Kevin M.
Shinko Electric Industries Co. Ltd.
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