Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2007-11-13

2007-11-13

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S118000, C438S119000, C438S508000

Reexamination Certificate

active

11146610

ABSTRACT:
A method for manufacturing a semiconductor device that includes mounting a semiconductor chip on a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, in which the bump is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, without a stepped portion formed on a surface of the bump, and a cross sectional shape of the bump taken in a width direction of the wiring layer is such that a central portion is higher than both side portions. The method also includes connecting electrode pads of the semiconductor chip to the bumps, thereby achieving connection between the electrode pads of the semiconductor chip and the wiring layers via the bumps.

REFERENCES:
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5604156 (1997-02-01), Chung et al.
patent: 5660177 (1997-08-01), Faupel et al.
patent: 5844320 (1998-12-01), Ono et al.
patent: 5982629 (1999-11-01), Shoji et al.
patent: 6042999 (2000-03-01), Lin et al.
patent: 6043429 (2000-03-01), Blish et al.
patent: 6133534 (2000-10-01), Fukutomi et al.
patent: 6137184 (2000-10-01), Ikegami
patent: 6223429 (2001-05-01), Kaneda et al.
patent: 6568073 (2003-05-01), Fukutomi et al.
patent: 6730858 (2004-05-01), Gotoh et al.
patent: 6918529 (2005-07-01), Tsukaguchi et al.
patent: 1 215 719 (2002-06-01), None
patent: 59-130434 (1984-07-01), None
patent: 63-160350 (1988-07-01), None
patent: 63-193536 (1988-08-01), None
patent: 5-206204 (1993-08-01), None
patent: 5-243332 (1993-09-01), None
patent: 6-5778 (1994-01-01), None
patent: 8-97301 (1996-04-01), None
patent: 8-172242 (1996-07-01), None
patent: 9-82747 (1997-03-01), None
patent: 10-233571 (1998-09-01), None
patent: 2001-168129 (2001-06-01), None
patent: 485515 (2002-05-01), None
patent: 492051 (2002-06-01), None
Taiwanese Office Action from corresponding Taiwanese application 094109385, mailed Apr. 17, 2007.

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