Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2006-10-31

2006-10-31

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

With measuring or testing

C438S005000, C438S010000, C438S017000

Reexamination Certificate

active

07129099

ABSTRACT:
A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed. The manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed, the processes sharing a monitoring step alone, the main body wafer manufacturing process including a variation reduction step, the monitor wafer manufacturing process including a quality check step and a condition setting step.

REFERENCES:
patent: 5399229 (1995-03-01), Stefani et al.
patent: 5943552 (1999-08-01), Koveshnikov et al.
patent: 6511889 (2003-01-01), Takiguchi
patent: 6861268 (2005-03-01), Iwabuchi
patent: 6950716 (2005-09-01), Ward et al.
patent: 2002/0155630 (2002-10-01), Iwabuchi
patent: 5-347295 (1993-12-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3716922