Method for manufacturing semiconductor device

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Reexamination Certificate

active

07076317

ABSTRACT:
A flagship line1includes a job shop environment and a flow shop environment where three different standalone processing apparatuses for different steps constitute the job shop environment and two different serial processing apparatuses constitute the flow shop environment. One of the two serial processing apparatuses as a first serial processing apparatus8consists of a die bonder5, a clean cure unit6, and a wire bonder7and sequentially performs die bonding, clean cure and wire bonding. The other or second serial processing apparatus13consists of a marking unit9, a cutting unit10, a testing unit11, and a visual inspection unit12and sequentially performs marking, lead cutting, testing, and visual inspection. The three standalone processing apparatuses are a dicing apparatus2, a molding apparatus4, and a visual inspection apparatus3. This not only minimizes the possibility of a stagnant flow of workpieces between steps but also substantially shortens the overall processing time.

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patent: 2000-99111 (2000-04-01), None

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