Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-07-11
2000-06-06
Fahmy, Wael
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438123, H01L 2144
Patent
active
060717599
ABSTRACT:
In a hardening temperature profile of a paste material for fixing a lead-frame to a semiconductor chip, a heating temperature from a first sub-zone to a third sub-zone is set to 150.degree. C. and a heating temperature from a fourth sub-zone to a sixth sub-zone is set to a maximum value of 230.degree. C. at a first heating step of a chip fixing step. Then, in the hardening temperature profile, a heating temperature of a seventh sub-zone is set to 180.degree. C. having a drop width from the sixth sub-zone of 50 degrees and a heating temperature of an eighth sub-zone is set to 130.degree. C. having a drop width from the seventh sub-zone of 50 degrees at a second heating step of the chip fixing step.
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Fukuzaki Junichi
Kawakami Yoshihiko
Kojima Masatoshi
Sugita Junji
Eaton Kurt
Fahmy Wael
Matsushita Electronics Corporation
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