Method for manufacturing resin-sealed semiconductor device

Details Method for manufacturing resin-sealed semiconductor device Method for manufacturing resin-sealed semiconductor device

1984-12-18

1986-06-03

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29591, 174 52PE, 357 70, 357 72, 83914, 264161, 26427217, 264276, 264344, H01L 2156

Patent

active

045921318

ABSTRACT:
A method for manufacturing a resin-sealed semiconductor device wherein after a semiconductor pellet is sealed to a leadframe with a resin, outer leads projected from the leadframe and adhered with burrs are collapsed by their upper or upper and lower corners and then the burrs are removed by blasting.

REFERENCES:
patent: 3539675 (1970-11-01), Hugill
patent: 4451973 (1984-06-01), Tateno et al.

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