Coating processes – Electrical product produced – Metal coating
Patent
1995-04-06
1998-06-16
Beck, Shrive
Coating processes
Electrical product produced
Metal coating
427404, 4274432, 205291, B05D 512, B05D 136, B05D 118
Patent
active
057666768
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a nickel-metallic hydride battery. More particularly, this invention relates to a method for manufacturing a metallic hydride electrode used as the cathode.
2. Description of the Prior Art
The former method of manufacturing a metallic hydride electrode by using a rare earth-nickel hydrogen storage alloy was that it was manufactured by filling hydrogen-stored alloy powder in foam nickel and compressing it or hydrogen-storage alloy powder was manufactured in the form of an electrode by plating It with copper without electrolysis and molding it subsequently or by using an organic bonding agent.
However, the former method of manufacturing an electrode by plating alloy powder with copper without electrolysis and molding it merely was not able to achieve necessary molding and electric plating because copper plating was not so uniform that copper amounted to 15 to 25% of alloy weight.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a method for manufacturing a rare earth-nickel-matallic hydride electrode which increases the amount of plating the surface of a molded electrode with copper by plating alloy powder with copper amounting to about 10% of alloy weight without electrolysis and molding it subsequently and again plating it with copper amounting to about 5% of alloy weight without electrolysis, thereby improving mechanical strength, electric conductivity and reaction velocity.
DESCRIPTION OF THE DRAWINGS
FIG. 1 is a process diagram showing the stages of soaking a metallic hydride electrode in an acid nonelectrolytic plating solution according to the present invention.
FIG. 2 is a process diagram showing the stages of maintaining a metallic hydride electrode wet in an acid nonelectrolytic plating solution in the atmosphere according to the present invention.
FIG. 3 is a process diagram showing the stages of washing an acid nonelectrolytic plating solution in water from an electrode plating of which is finished according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION
As illustrated in FIG. 1, a metallic hydride electrode 1 is manufactured by plating alloy powder with copper without electrolysis and molding it subsequently. The metallic hydride electrode 1 Is soaked in an acid-non-electrolytic copper plating solution 2 which contains a high percentage of copper and ion. The plating solution 2 is composed of 10 to 40 g of CuSO.sub.4 .multidot.5H.sub.2 0, 100 g of H.sub.2 0 and 0.3 to 1.0 ml of H.sub.2 SO.sub.4. Plating amount are determined by the ratio of the amount of Cu ion in the solution to the amount of alloy to be coated. Then, pores of the electrode is completely filled with plating solution and it is taken out.
As illustrated in FIG. 2, the electrode 1 wet in the plating solution 2 is kept for about 3 to 5 minutes until copper plating is finished in the atmosphere while it is maintained horizontally so that the plating solution may not flow down.
Thereafter, the electrode 1 is washed in water before its plating solution gets dry, as illustrated in FIG. 3.
The method of manufacturing a rare earth-nickel-metallic hydride electrode according to the present invention increases the amount of plating the surface of a molded electrode by plating alloy powder with copper amounting to about 10% of alloy weight without electrolysis and molding it subsequently and again plating a molded article with copper amounting to about 5% of alloy weight, thereby improving mechanical strength and reaction velocity, as compared with the former method of using foam nickel or plating it with copper without electrolysis and molding it merely or manufacturing an electrode by using an organic bonding agent. Moreover, the present invention improves electric conductivity, quickens charging and discharging velocity, reduces falling off of alloy powder and increases charging and discharging cycle life as internal resistance is reduced. Because copper does not have the capability of s
REFERENCES:
patent: 3650777 (1972-03-01), Schneble, Jr. et al.
patent: 4997729 (1991-03-01), Hatoh et al.
patent: 5128219 (1992-07-01), Kohler et al.
patent: 5393616 (1995-02-01), Mori et al.
E. B. Saubestre, Electroless Copper Plating, 1959 pp. 264-265.
Choi In Sik
Park Chung Neun
Beck Shrive
Chen Bret
Gold Star Cable Co., Ltd.
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