Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2007-09-18
2007-09-18
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S125000, C257SE21502
Reexamination Certificate
active
11126314
ABSTRACT:
A method for manufacturing a radiofrequency identification device which includes a manufacturing process for an antenna which includes screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting the support to heat treatment to bake and polymerize the conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination which includes making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, and removal of the transfer paper sheet.
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ASK S.A.
Geyer Scott B.
Lydon James C.
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