Method for manufacturing printing head

Semiconductor device manufacturing: process – Manufacture of electrical device controlled printhead

Reexamination Certificate

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Details

C438S273000, C257SE27001

Reexamination Certificate

active

07732228

ABSTRACT:
A process for manufacturing a printing head is able to maintain an appropriate connection between a substrate and flying leads. The process includes a connecting step of connecting electric connection terminals of a substrate and flying leads provided on an electric wiring basic material and a mounting step of mounting a unit consisting of the electric wiring base material and the substrate connected together, on a printing head main body. During the connecting step, the substrate and each flying lead are electrically connected together with a predetermined distance between them. During the mounting step, the unit is fixed to the printing head main body so that the distance between each of the electric connection terminals of the substrate and the electric wiring base material is shorter than the predetermined distance. This forms a slack shape of each flying lead.

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