Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2004-08-19
2009-06-02
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C174S255000, C174S264000, C174S266000
Reexamination Certificate
active
07540082
ABSTRACT:
A printed wiring board having a through hole conductor formed on the surface of a through hole formed in a copper-clad laminate board, and on the surface of the copper-clad laminate board1in the vicinity of an opening of the through hole. The through hole conductor is filled with a positive photosensitive resin. A capped conductor is formed on the positive photosensitive resin and is coupled to the through hole conductor. Further, a circuit pattern is formed on the surface of the copper-clad laminate board. An insulating layer is formed on the surface of the copper-clad laminate board, capped conductor, and the circuit pattern, and formed with a via hole extending from the surface of the insulating layer to the capped conductor. A via conductor is formed inside the via hole and on the surface of the insulating layer in the vicinity of an opening of the via hole.
REFERENCES:
patent: 6225031 (2001-05-01), Appelt et al.
patent: 6426011 (2002-07-01), Katoh
patent: 6662442 (2003-12-01), Matsui et al.
patent: 6930258 (2005-08-01), Kawasaki et al.
patent: 7178234 (2007-02-01), Kawasaki et al.
patent: 2001/0025414 (2001-10-01), Toyoshima et al.
patent: 2004/0154163 (2004-08-01), Miyazaki et al.
patent: 2005/0189136 (2005-09-01), Kawasaki et al.
patent: 2007/0175025 (2007-08-01), Tsukamoto et al.
patent: 6-275959 (1994-09-01), None
patent: 6-302963 (1994-10-01), None
patent: PUPA 06-302963 (1994-10-01), None
patent: 9-312459 (1997-12-01), None
patent: PUPA 09-312459 (1997-12-01), None
patent: 11-68297 (1999-03-01), None
patent: A-H11-274730 (1999-10-01), None
patent: A-2001-291956 (2001-10-01), None
European Search Report, Sep. 18, 2008, JP920030157EP1, 04771846.5-1235/1662850, PCT/JP2004011885.
Kobayashi Kaoru
Ohsumi Kohichi
Arbes C. J
Canale Anthony J.
International Business Machines - Corporation
LandOfFree
Method for manufacturing printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing printed wiring board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4145255