Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-02-06
2007-02-06
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C361S777000, C174S255000, C427S096100
Reexamination Certificate
active
10537994
ABSTRACT:
There is provided a method for manufacturing a flat printed wiring board in which spaces between circuit patterns are filled with a resin. The method comprises: laminating via a mold release film a plurality of sets of laminated bodies formed by superposing a semi-cured resin sheet on a printed wiring board with circuit patterns formed thereon; placing the laminated plural sets of the laminated bodies interposed between a pair of smoothing plates and collectively pressing the laminated bodies in a reduced pressure atmosphere used for curing the resin; and then polishing the cured resin covering the circuit patterns, thereby exposing the circuit patterns.
REFERENCES:
patent: 6739040 (2004-05-01), Nakamura et al.
patent: 2005/0258522 (2005-11-01), En et al.
patent: 2006/0037193 (2006-02-01), Enomoto et al.
patent: 2006/0115582 (2006-06-01), Murakami
patent: 3-34494 (1991-02-01), None
patent: 8-293673 (1996-11-01), None
patent: 9-116264 (1997-05-01), None
patent: 10-242621 (1998-09-01), None
patent: 2000-332387 (2000-11-01), None
Coleman W. David
Noda Screen Co., Ltd.
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