Printing – Stenciling – Processes
Reexamination Certificate
2007-11-15
2010-12-21
Yan, Ren (Department: 2854)
Printing
Stenciling
Processes
C101S127000
Reexamination Certificate
active
07854197
ABSTRACT:
An exemplary legend printing stencil for printing a circuit substrate for manufacturing a number of printed circuit board is provided. The stencil includes at least a first printing portion, at least a second printing portion and a junction portion between the first printing portion and the second printing portion. The first printing portion and the second printing portion each define a number of legend holes therein. The first printing portion and the second portion are configured for attaching on and covering the corresponding circuit board unit of the circuit substrate to print legends on the circuit board unit. The junction portion defines a slot therein and is configured for attaching on and covering the corresponding connection portion of the circuit substrate to print a legend ink layer on the connection portion. A method for manufacturing a number of printed circuit boards using the stencil is also provided.
REFERENCES:
patent: 5878662 (1999-03-01), McCue
patent: 6363847 (2002-04-01), Murakami
patent: 6548106 (2003-04-01), Murakami
patent: 2002-164645 (2002-06-01), None
patent: 550173 (2003-09-01), None
patent: 558927 (2003-10-01), None
Huang Chun-Ta
Huang Hsiao-Chun
Wu Meng-Hung
Yeh Tso-Hung
Foxconn Advanced Technology Inc.
Knapp Jeffrey T.
Yan Ren
LandOfFree
Method for manufacturing printed circuit boards using legend... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing printed circuit boards using legend..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing printed circuit boards using legend... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4211427