Method for manufacturing printed circuit boards

Details Method for manufacturing printed circuit boards Method for manufacturing printed circuit boards

2007-05-08

2007-05-08

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S831000, C029S846000, C174S261000, C427S097200

Reexamination Certificate

active

10788392

ABSTRACT:
The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on a first main side of the insulating board, bonding a second conductor layer to a second main side of the insulating board having the holes, forming a third conductor layer on the whole first main side of the insulating board after bonding the second conductor layer, masking preset holes with a plating resist, plating the first conductor and holes in the insulating board, patterning the first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing the plating resist and the third conductor layer from an area which is covered with the plating resist.

REFERENCES:
patent: 4908933 (1990-03-01), Sagisaka et al.
patent: 4915983 (1990-04-01), Lake et al.
patent: 5665525 (1997-09-01), Pienimaa
patent: 5837154 (1998-11-01), Okabe et al.
patent: 6014805 (2000-01-01), Buixadera Ferrer
patent: 6981320 (2006-01-01), Ho et al.
patent: 7013563 (2006-03-01), Durkot
patent: 10-12677 (1998-01-01), None

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