Method for manufacturing printed circuit boards

Details Method for manufacturing printed circuit boards Method for manufacturing printed circuit boards

2005-10-11

2005-10-11

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S831000, C029S847000, C427S096100, C427S097100, C427S097300

Reexamination Certificate

active

06952871

ABSTRACT:
It consists of making a first engraving over a first face of a panel of electro-conducting material to form some reliefs and depressions corresponding to future tracks and intermediate tracks; subjecting said first face to a black oxide treatment (40); applying a layer of an adhesive material over said first face previously engraved and treated with black oxide; applying by injection moulding a dielectric material (20) over said previously engraved first face, treated and with the adhesive applied, covering said reliefs and filling said depressions; and carrying out a second selective engraving over a second face, opposite to the first one, of the mentioned panel to eliminate the material thereof corresponding to said future intermediate tracks, so that some finished tracks (16) remain insulated from each other, partially embedded on a face of said dielectric material (20) and separated by intermediate tracks (18).

REFERENCES:
patent: 3177103 (1965-04-01), Tally et al.
patent: 4087300 (1978-05-01), Adler
patent: 5233753 (1993-08-01), Wolf et al.
patent: 5525433 (1996-06-01), Poutasse et al.
patent: 5861076 (1999-01-01), Adlam et al.
patent: 6182359 (2001-02-01), Nieto
patent: 6516665 (2003-02-01), Varadan et al.
patent: 6668450 (2003-12-01), Haller et al.
patent: 0 923 278 (1999-06-01), None
patent: 0 929 208 (1999-07-01), None
patent: 2 125 821 (1999-03-01), None

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