Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-01-08
2010-02-02
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S858000, C029S841000, C029S832000, C029S855000, C029S842000, C361S793000, C174S262000
Reexamination Certificate
active
07653991
ABSTRACT:
A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.
REFERENCES:
patent: 2005/0048759 (2005-03-01), Hsu
patent: 2006/0068332 (2006-03-01), Chen
Kim Ki-Hwan
Kim Sung-Yong
Mok Jee-Soo
Park Jun-Heyoung
Banks Derris H
Le Dan D
Samsung Electro-Mechanics Co. Ltd.
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