Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-08-02
2011-08-02
Banks, Derris H (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S832000, C029S846000, C029S852000
Reexamination Certificate
active
07987586
ABSTRACT:
A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.
REFERENCES:
patent: 4777718 (1988-10-01), Henderson et al.
patent: 5382930 (1995-01-01), Stokes et al.
patent: 6352876 (2002-03-01), Bordogna et al.
patent: 7060912 (2006-06-01), Nagashima et al.
He Dong-Qing
Lee Wen-Chin
Wang Ming
Zhu Yun-Li
Banks Derris H
Cheng Andrew C.
Foxconn Advanced Technology Inc.
FuKui Precision Component (Shenzhen) Co., Ltd.
Nguyen Tai
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