Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Reexamination Certificate
2005-05-10
2005-05-10
Mills, Gregory (Department: 1763)
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
C029S830000
Reexamination Certificate
active
06890449
ABSTRACT:
A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
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Kawamoto Eiji
Nishii Toshihiro
Takenaka Toshiaki
Yamane Shigeru
Culbert Roberts
Mills Gregory
Parkhurst & Wendel L.L.P.
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