Method for manufacturing printed circuit board

Details Method for manufacturing printed circuit board Method for manufacturing printed circuit board

2005-04-05

2005-04-05

Stoner, Kiley S. (Department: 1725)

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

C510S175000

Reexamination Certificate

active

06874675

ABSTRACT:
A method for manufacturing a printed circuit board includes: washing a land that corresponds to the exposed portion of a copper circuit of a printed circuit board with acidic electrolytic water having a pH of not more than 5 to remove an oxide; treating the land with basic electrolytic water having a pH of not less than 9 to prevent oxidation; and soldering electronic components to the land. The portion to be soldered is treated with the electrolytic water beforehand, thereby improving soldering at low cost without any adverse effect on the environment.

REFERENCES:
patent: 3882000 (1975-05-01), Schwartz et al.
patent: 4968397 (1990-11-01), Asher et al.
patent: 5496590 (1996-03-01), Maki et al.
patent: 6034422 (2000-03-01), Horita et al.
patent: 6268619 (2001-07-01), Kosaki et al.
patent: 20040079791 (2004-04-01), Kida et al.
patent: 20040108224 (2004-06-01), Robertson et al.
patent: 5-186713 (1993-07-01), None
patent: 2923596 (1999-05-01), None
patent: 02003304051 (2003-10-01), None
patent: 020004047827 (2004-02-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing printed circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3366652