Method for manufacturing pressure contact semiconductor devices

Details Method for manufacturing pressure contact semiconductor devices Method for manufacturing pressure contact semiconductor devices

1987-06-03

1989-02-07

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

29511, 357 79, B01J 1700, H01L 2304, H01L 2310, H01L 2348

Patent

active

048031801

ABSTRACT:
A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.

REFERENCES:
patent: 3474302 (1969-10-01), Blundell
patent: 3683492 (1972-08-01), Meyerhoff et al.
patent: 3858096 (1974-12-01), Kuhrt et al.
patent: 3950778 (1976-04-01), Pomper et al.
patent: 4305087 (1981-12-01), Wislocky
patent: 4760037 (1988-07-01), Ohdate

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