Method for manufacturing preforms coated with hard solder for re

Details Method for manufacturing preforms coated with hard solder for re Method for manufacturing preforms coated with hard solder for re

1989-03-16

1991-11-12

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

156634, 156656, 1566591, 228 563, H01R 4300

Patent

active

050636600

ABSTRACT:
A method for manufacturing preforms coated with hard solder for repairing interconnect interruptions. The manufacture of preforms with which interconnect interruptions are bridged and that are electrically and mechanically joined to the interconnect at both sides of the interruption was previously carried out by punching from a metal band coated with hard solder. In the course of the miniaturization of interconnects to a width of less than 100 .mu.m, such a punching method is no longer feasible. The present etching technique provides a preform panel having a plurality of preforms, whereby, a hard solder layer has not yet been applied to the metal band at the point in time of etching. This avoids what are referred to as under-etchings. The method provides that a hard solder layer is applied by sputtering on the etched-out preform that is merely composed of a substrate that was manufactured from the metal band.

REFERENCES:
patent: 3617373 (1971-11-01), Mott
patent: 4597828 (1986-07-01), Tadros
patent: 4620365 (1986-11-01), Burger et al.
patent: 4803110 (1989-02-01), Ahn et al.
"Open Conductor Repair for Glass Metal Module" by F. M. Tappen, IBM Technical Disclosure Bulletin, vol. 14, No. 10 dated Mar. 1972, p. 2915.

Affiliated with

Also associated with

Rating

Method for manufacturing preforms coated with hard solder for re does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing preforms coated with hard solder for re, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing preforms coated with hard solder for re will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1005045