Method for manufacturing porous semiconductor light emitting dev

Fishing – trapping – and vermin destroying

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437 71, 437129, 437132, 437174, 437173, 437248, H01L 2120

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054279771

ABSTRACT:
An Si or SiC semiconductor layer is subjected to anodic oxidation in an HF solution to form a porous semiconductor layer. Without drying, the porous semiconductor layer is then immersed in pure water. Ultrasonic waves applied to the pure water shorten the reaction time and help bubbles separate from the surface of the porous region. The porous semiconductor layer is used for forming a pn junction, and carriers are injected into the pn junction.

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