Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1997-06-27
1999-08-10
Ortiz, Angela
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427217, 264275, 264278, B29C 3312, B29C 4502, B29C 7070
Patent
active
059355026
ABSTRACT:
A method for forming a package of plastic material for a semiconductor electronic device having heat sink fully embedded within the package plastic case, is of the type which provides for forming the plastic case within a mold on whose interior a heat sink has been placed which has a first major surface to be insulated by means of a plastic material layer with a first thickness, whereon a metal leadframe and at least one semiconductor material die having an electronic circuit formed thereon have been fixed, and a second major surface opposite from the first and to be insulated by means of a plastic material layer with a second thickness, thinner than said first thickness; and at least one supporting element adapted to be positioned inside the mold cavity facilitating properly spacing the second surface of the heat sink out from a facing wall of the mold cavity during the process of introducing the plastic material for molding. The heat sink is supported only from the side of the second surface by said at least one supporting element being attached to said wall of the cavity and held within the mold cavity during the injection of plastic material and until the latter becomes fully solidified; each of the supporting elements is provided with a tip having a sharp top of negligible cross-sectional area compared to the tip base; during the molding process, each of the tips is inserted into a portion of a corresponding trench formed in the second surface of the heat sink such that is left unencumbered in said trench portion a peripheral region around said tip to let a flow of plastic material run past during the molding process.
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Ferri Stefano
Rossi Roberto
Ortiz Angela
SGS-Thomson Microelectronics
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