Method for manufacturing plastic encapsulated electronic semicon

Details Method for manufacturing plastic encapsulated electronic semicon Method for manufacturing plastic encapsulated electronic semicon

1988-12-28

1990-09-04

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

249 91, 26427214, 26427217, 264278, 2643287, 26432812, 425116, B29C 4502, B29C 4514

Patent

active

049543075

ABSTRACT:
A method for manufacturing plastic encapsulated electronic semiconductor devices is disclosed in which a support pad is firmly fixed by slidable means and also by mold halves in molding operation. Slidable means is moved outward of a cavity when it is filled with the plastic encapsulating material to the half volume. Spaces, which are formed after movement of slidable means, are filled with the plastic encapsulating material directly poured through a gate. The encapsulated semiconductor devices indicate excellent thermal radiation and dielectric strength characteristics without formation of voids or unfilled portions in the plastic.

REFERENCES:
patent: 4377548 (1983-03-01), Pierpont
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4723899 (1988-02-01), Osada

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