Method for manufacturing piezoelectric film element, and...

Details Method for manufacturing piezoelectric film element, and... Method for manufacturing piezoelectric film element, and...

2011-01-18

2011-01-18

SanMartin, J. (Department: 2837)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C252S06290R, C252S06290R

Reexamination Certificate

active

07872403

ABSTRACT:
A method for manufacturing a piezoelectric film element includes foursteps. The first is to form a bottom electrode on a Si substrate. The second is to form a seed layer with a layered perovskite structure on the bottom electrode. The third is to form a Bi4Ti3O12—BaBi4Ti4O15based piezoelectric film on the seed layer. The final step is to form an top electrode on the piezoelectric film.

REFERENCES:
patent: 5821005 (1998-10-01), Kijima et al.
patent: 6333066 (2001-12-01), Kim
patent: 7279825 (2007-10-01), Ifuku et al.
patent: 7312558 (2007-12-01), Fujii et al.
patent: 7494601 (2009-02-01), Wang et al.
patent: 7766464 (2010-08-01), Noguchi et al.
patent: 2005/0218466 (2005-10-01), Kondo et al.
patent: 2008/0123243 (2008-05-01), Hamada et al.
patent: 2008/0224571 (2008-09-01), Miyazawa et al.
patent: 2009/0160914 (2009-06-01), Fujii
patent: 2009/0244213 (2009-10-01), Shimada
patent: 2010/0147789 (2010-06-01), Kurachi et al.
patent: 2010/0155647 (2010-06-01), Saito et al.
patent: 08-306231 (1996-11-01), None
patent: 2004-296679 (2004-10-01), None
patent: 2005-159309 (2005-06-01), None
patent: 2005-255424 (2005-09-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing piezoelectric film element, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing piezoelectric film element, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing piezoelectric film element, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2635266