Method for manufacturing phosphor, phosphor and plasma...

Compositions – Inorganic luminescent compositions – Compositions containing halogen; e.g. – halides and oxyhalides

Reexamination Certificate

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C216S096000, C216S099000, C216S101000, C216S108000, C264S021000, C252S30140S, C252S30140F, C252S30140P, C252S30140H, C252S30160R, C252S301500, C252S30160S, C252S30160F, C252S30160P

Reexamination Certificate

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07399430

ABSTRACT:
It is an object of the present invention to control damage of a phosphor caused by an etching solution. Disclosed is a method of manufacturing a phosphor having the steps of: (a) crushing phosphor particles via a crushing treatment process, and (b) surface-treating phosphor particles dispersed in a solvent by adding an etching solution via a surface treatment process, wherein an adding speed of the etching solution is in a range of 1.2×10−16-7.0×10−15mol/min. per 1 m2of specific surface area of the phosphor particles.

REFERENCES:
patent: 2164533 (1939-07-01), Leverenz
patent: 3597366 (1971-08-01), Graff et al.
patent: 6454967 (2002-09-01), Im et al.
patent: 2000-226577 (2000-08-01), None
patent: 2001-172622 (2001-06-01), None
patent: 2003-292950 (2003-10-01), None
Derwent Abstract of JP-2000-226577.
Derwent Abstract of JP-2003-292950.

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