Method for manufacturing packaged solid electrolytic capacitor

Details Method for manufacturing packaged solid electrolytic capacitor Method for manufacturing packaged solid electrolytic capacitor

1996-04-04

1998-11-24

Niebling, John

Metal working

Barrier layer or semiconductor device making

Barrier layer device making

438 14, H01G 900, G01R 3126, H01L 2166

Patent

active

058400869

ABSTRACT:
An improved method for manufacturing a capacitor packaged by synthetic resin after welding an anode bar of a capacitor element with a lead terminal of a lead frame and electrically connecting a cathode of the capacitor element with another lead terminal of the lead frame, wherein the capacitor is assembled after measuring an inclination of the capacitor element in the horizontal/vertical direction after welding the anode bar of the capacitor element with the lead terminal and correcting the inclination of the capacitor element by pressing a portion of the lead terminal to which the anode bar is welded corresponding to the direction of the inclination when the inclination exceeds a predetermined value. As a result, no stress is applied to the capacitor element itself, so that no element is rendered defective or no element characteristic is damaged. In the same time, no capacitor element part will protrude out of the package or no thin package portion is created due to the inclination of the capacitor element, so that the reliability is kept.

REFERENCES:
patent: 4660127 (1987-04-01), Gunter
patent: 5099397 (1992-03-01), Edson et al.
patent: 5315474 (1994-05-01), Kuriyama
patent: 5402307 (1995-03-01), Kuriyama
patent: 5478965 (1995-12-01), Hashiba

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