Method for manufacturing P type semiconductor device employing d

Fishing – trapping – and vermin destroying

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437 41, 437 44, 437141, 437149, 437150, 437152, 437153, 437154, 437160, 437168, 437162, H01L 21223, H01L 21225, H01L 21383, H01L 21385

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049961683

ABSTRACT:
An improved method for manufacturing P type semiconductor device such as used for memories is disclosed. Channeling such as caused by an ion implantation process is prevented by adopting a diffusion method to diffuse boron (7) from a boron glass formed on a layer of polysilicon or silicon oxide on a semiconductor substrate. This method provides a semiconductor device with shallow P type impurity diffusion regions.

REFERENCES:
patent: 3914138 (1975-10-01), Rai-Choudhury
patent: 3928096 (1975-12-01), Vergano et al.
patent: 3940747 (1976-02-01), Kuo et al.
patent: 3998668 (1976-12-01), Florence et al.
patent: 3999213 (1976-12-01), Brandt et al.
patent: 4006046 (1977-02-01), Pravin
patent: 4016594 (1977-04-01), Shappir
patent: 4115796 (1978-09-01), Fujimoto et al.
patent: 4175317 (1979-11-01), Aoki et al.
patent: 4188707 (1980-02-01), Asano et al.
patent: 4203126 (1980-05-01), Yim et al.
patent: 4204894 (1980-05-01), Komeda et al.
patent: 4232328 (1980-11-01), Hartman et al.
patent: 4242693 (1980-12-01), Biran
patent: 4273805 (1981-06-01), Dawson et al.
patent: 4305086 (1981-12-01), Khajezadeh
patent: 4313782 (1982-02-01), Sokoloski
patent: 4404733 (1983-09-01), Sasaki
patent: 4466175 (1984-08-01), Coe
patent: 4498094 (1985-02-01), Houthoff et al.
patent: 4558507 (1985-12-01), Okabayashi et al.
patent: 4595941 (1986-06-01), Avery
patent: 4603472 (1986-08-01), Schwabe et al.
patent: 4654121 (1987-03-01), Miller et al.
patent: 4755479 (1988-07-01), Miura
S. K. Ghandhi, VLSI Fabrication Principles, J. Wiley & Sons, 1983, pp. 440 to 441.
W. Maly, "Atlas of IC Technologies: An Introduction to VLSI Processes", The Benjamin/Cummings Publishing Co. Inc., Advanced NMOS Technology.
Broadbent et al., "Self-Aligned Silicided (PtSi and CoSi.sub.2) Ultra-Shallow p.sup.+
Junctions", IEEE Electron Device Letters, vol. EDL-8, No. 7, Jul. 1987.
N. Goldsmith et al., "Boron Nitride as a Diffusion Source for Silicon", RCA Reviewing, No. 2 (Jun. 1967).
A. C. Adams and C. D. Capio, "The Chemical Deposition of Boron-Nitrogen Films", J. Electrochem. Soc.: Solid-State Science and Technology, vol. 127, No. 2 (Feb. 1980).
A. Adams et al., "The High Temperature Deposition and Evaluation of Phosphorus- or Boron-Doped Silicon Dioxide Films", J. Electrochem. Soc.: Solid-State Science and Technology, vol. 1, 126, No. 2 (Feb. 1979).

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