Method for manufacturing over-current protection device

Details Method for manufacturing over-current protection device Method for manufacturing over-current protection device

2011-02-22

2011-02-22

Osele, Mark A (Department: 1745)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S250000, C156S252000, C156S256000, C156S306600, C156S309600, C174S524000, C338S324000, C361S103000

Reexamination Certificate

active

07892392

ABSTRACT:
A method for manufacturing an over-current protection device comprises a step of providing at least one current sensitive device and a step of pressing. The current sensitive device comprises a first electrode foil, a second electrode foil and a PTC conductive layer physically laminated between the first and second electrode foils. The pressing step is to press the current sensitive device at a predetermined temperature, thereby generating at least one overflow portion at sides of the PTC conductive layer to form the over-current protection device. The predetermined temperature is higher than the softening temperature of the PTC conductive layer. The over-current protection devices manufactured according to the present invention have superior resistance distribution.

REFERENCES:
patent: 5849129 (1998-12-01), Hogge et al.
patent: 6143206 (2000-11-01), Handa et al.
patent: 2004/0027765 (2004-02-01), Yu et al.

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