Method for manufacturing optocoupler

Details Method for manufacturing optocoupler Method for manufacturing optocoupler

2007-06-26

2007-06-26

Pyo, Kevin (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Signal isolator

C257S080000, C438S024000

Reexamination Certificate

active

11400220

ABSTRACT:
A multichannel monolithic chip that has a number of photo-couplers provided on a single silicon substrate is mounted on an insulating substrate, a first cut groove is formed by dicing between a light-emitting element and a light-receiving element that constitute a photo-coupler, a transparent insulating resin is filled into the first cut groove and then a second cut groove is formed by dicing between the adjacent photo-couplers, each of the light-emitting element and the light-receiving element is electrically connected to an external terminal using a bonding wire, and the entirety of the insulating substrate is molded with a light-blocking resin.

REFERENCES:
patent: 3914137 (1975-10-01), Huffman et al.
patent: 6759667 (2004-07-01), Yasuda
patent: 2005/0218300 (2005-10-01), Quinones et al.
patent: 48-46278 (1973-07-01), None
patent: 6-5906 (1994-01-01), None
patent: 7-312443 (1995-11-01), None

Affiliated with

Also associated with

Rating

Method for manufacturing optocoupler does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing optocoupler, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing optocoupler will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3878673