Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Groove formation
Reexamination Certificate
2006-10-10
2006-10-10
Ngô, Ngân V. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Groove formation
C438S421000, C438S700000, C438S701000
Reexamination Certificate
active
07118933
ABSTRACT:
An optical bench on which an optical component is mounted comprises an Si substrate made of a silicon wafer, a groove disposed on the Si substrate and designed to mount the optical component thereon, and a metal thin-film wiring for driving the optical component or a driver component. The metal thin-film wiring is formed in an electroless plating process before a groove manufacturing process which forms the groove by micromachining by means of wet processing.
REFERENCES:
patent: 6879035 (2005-04-01), Syllaios et al.
patent: 2005/0070059 (2005-03-01), Blakers et al.
patent: 2005/0269700 (2005-12-01), Farnworth et al.
patent: 2006/0009038 (2006-01-01), Cohen et al.
English language abstract of JP 2002-162542 (Jun. 7, 2002).
Fukao Ryuzou
Sanbe Tetsuhiko
Birch & Stewart Kolasch & Birch, LLP
Hitachi Maxell Ltd.
Ngo Ngan V.
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