Method for manufacturing nitride semiconductor laser element

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Groove formation

Reexamination Certificate

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C438S039000, C438S040000, C438S043000, C257S627000, C257S623000, C257SE33003

Reexamination Certificate

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08053262

ABSTRACT:
A method for manufacturing a nitride semiconductor laser element having a nitride semiconductor layer including at least an active layer provided on a substrate, a pair of cavity planes formed on the nitride semiconductor layer, and a protruding part where part of the substrate protrudes from said cavity plane, said method comprises: a step of forming the nitride semiconductor layer on the substrate; a first etching step of forming a first groove by etching at least the nitride semiconductor layer; and a second etching step of forming the cavity plane, in the second etching step, the inner wall of the first groove and part of the nitride semiconductor layer surface adjacent to the first groove are etched to form a second groove, and form the upper face of the protruding part.

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