Method for manufacturing nitride semiconductor device

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

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C257SE21097, C257S098000, C117S915000

Reexamination Certificate

active

07901966

ABSTRACT:
A method for manufacturing a nitride semiconductor device, comprises: epitaxially growing a semiconductor layer of a GaN-based material on the Ga surface of a GaN substrate while the GaN substrate is mounted on a substrate holder the substrate warping during the epitaxial growth so that a epitaxial deposit is deposited on the N surface of the substrate; and subjecting the N surface of the GaN substrate to vacuum suction after the epitaxial growth of the semiconductor layer; removing the epitaxial deposit from the N side of the GaN substrate after the semiconductor layer has been epitaxially grown, and before the N surface of the n-type GaN substrate is subjected to vacuum suction.

REFERENCES:
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patent: 2008/0293176 (2008-11-01), Oka et al.
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patent: 2001-250805 (2001-09-01), None
patent: 2002-270676 (2002-09-01), None
patent: 2005-353229 (2005-12-01), None
patent: 2008-251683 (2008-10-01), None

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