Method for manufacturing multilayer wiring board, and...

Details Method for manufacturing multilayer wiring board, and... Method for manufacturing multilayer wiring board, and...

2006-03-28

2006-03-28

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S846000, C427S096100

Reexamination Certificate

active

07017265

ABSTRACT:
A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.

REFERENCES:
patent: 4499152 (1985-02-01), Green et al.
patent: 6242079 (2001-06-01), Mikado et al.
patent: 6391220 (2002-05-01), Zhang et al.
patent: 5-335314 (1993-12-01), None
patent: 2001-323381 (2001-11-01), None

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