Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-01-18
2011-01-18
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S843000, C174S255000, C361S785000
Reexamination Certificate
active
07870663
ABSTRACT:
Provided is a method for manufacturing a multilayer wiring board, by which interlayer connection is efficiently performed and a non-penetrating hole having a hollow structure or a through hole can be formed at the same time without damaging a plated portion on the inner wall of the through hole. A first printed board (1) is provided with a wiring, which has a wiring section and a bump mounting pad (14), and a substrate section. The method is provided with a step of forming a solder bump (3) on at least a bump mounting pad on the first printed board or a pad section of a second printed board (2) having the pad section (15) by using a solder paste, and a step of bonding the first printed board and the second printed board in layers by having an insulating adhesive (4) between the first printed board and the second printed board and electrically connecting the first printed board with the second printed board.
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Katou Masahiro
Shinada Eiichi
Watanabe Noriaki
Antonelli, Terry Stout & Kraus, LLP.
Arbes C. J
Hitachi Chemical Company Ltd.
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