Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-10-01
2011-11-01
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S832000, C029S846000, C257SE23178, C257SE25011
Reexamination Certificate
active
08046914
ABSTRACT:
A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers.
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Kariya Takashi
Sakamoto Hajime
Sugiyama Tadashi
Wang Dongdong
Ibiden Co. Ltd.
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Phan Thiem
LandOfFree
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