Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-12-14
2011-10-25
Cazan, Livius R (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C156S306600, C174S254000
Reexamination Certificate
active
08042265
ABSTRACT:
A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
REFERENCES:
patent: 5499444 (1996-03-01), Doane et al.
Huang Szu-Min
Tu Chih-Yi
Zhang Jun-Qing
Cazan Livius R
Foxconn Advanced Technology Inc.
FuKui Precision Component (Shenzhen) Co., Ltd.
Knapp Jeffrey T.
LandOfFree
Method for manufacturing multilayer flexible printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing multilayer flexible printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing multilayer flexible printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4283831