Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2011-03-01
2011-03-01
Ahmed, Shamim (Department: 1713)
Etching a substrate: processes
Forming or treating electrical conductor article
C216S017000, C216S065000, C029S831000, C029S846000, C029S852000, C219S121190
Reexamination Certificate
active
07897055
ABSTRACT:
The present inventions relates to a method for manufacturing a multilayer FPCB having different number of layers in different areas. The method includes the steps of: providing a binder layer; removing a portion of the binder layer thereby defining an opening in the binder layer; forming a multilayer FPCB which having a first copper clad laminate structure and a second copper clad laminate structure disposed on two opposite sides of the binder layer respectively using the binder layer; cutting the first copper clad laminate structure; cutting the multilayer FPCB in manner that a portion of first copper clad laminate structure that is exposed to the opening is separated from the first copper clad structure thereby obtain a multilayer FPCB having different number of layers in different areas.
REFERENCES:
patent: 5421083 (1995-06-01), Suppelsa et al.
patent: 7581312 (2009-09-01), Tu et al.
patent: 2002/0023778 (2002-02-01), Watanabe
patent: 2005/0037281 (2005-02-01), Sato et al.
patent: 2008/0250637 (2008-10-01), Zhang et al.
Chiang I-Hsien
Lin Cheng-Hsien
Tu Chih-Yi
Ahmed Shamim
Foxconn Advanced Technology Inc.
Knapp Jeffrey T.
LandOfFree
Method for manufacturing multilayer flexible printed circuit... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing multilayer flexible printed circuit..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing multilayer flexible printed circuit... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2693369