Method for manufacturing multilayer circuit substrate

Details Method for manufacturing multilayer circuit substrate Method for manufacturing multilayer circuit substrate

1982-09-08

1985-06-25

Kittle, John E.

Coating processes

Electrical product produced

Condenser or capacitor

427 96, 427 98, 430314, B05D 512

Patent

active

045253838

ABSTRACT:
A method for manufacturing a multilayer circuit substrate includes the step of providing an insulating substrate formed of an inorganic oxide and supporting a laminate formed by alternately laminating wiring layers of copper and insulating layers of an inorganic oxide. The uppermost layer of the laminate is constituted by a copper wiring layer. A layer of electrically conductive material capable of being subjected to wire bonding is formed by a low temperature deposition on the surface of the laminate. Subsequently, the conductive material layer is selectively removed by photoetching to allow the portion connected to part of the uppermost copper wiring layer to remain. In this manner, the pattern layer capable of wire bonding can be formed.

REFERENCES:
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 4182781 (1980-01-01), Hooper et al.
patent: 4378384 (1983-03-01), Murakami et al.
A Fabrication Technique for Multilayer Ceramic Modules, Kaiser et al., Solid State Technology, May 1972, pp. 35-40.
Electrolles Gold Plating of Thick Films, Haddad, IBM Technical Disclosure Bulleten, 16(4), 9/73.

Affiliated with

Also associated with

Rating

Method for manufacturing multilayer circuit substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for manufacturing multilayer circuit substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing multilayer circuit substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-554338