Method for manufacturing multilayer ceramic substrates

Details Method for manufacturing multilayer ceramic substrates Method for manufacturing multilayer ceramic substrates

2005-09-06

2005-09-06

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S846000, C029S849000, C029S851000, C029S852000, C156S089120, C156S182000, C156S263000, C427S097200

Reexamination Certificate

active

06938332

ABSTRACT:
A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves. Conductors, which are formed into the external terminal electrodes, are exposed on parts of side surfaces of the multilayer ceramic substrate corresponding to parts of the inside surfaces of the through-holes.

REFERENCES:
patent: 5625935 (1997-05-01), Kubota et al.
patent: 5847326 (1998-12-01), Kawakami et al.
patent: 5858145 (1999-01-01), Sreeram et al.
patent: 5876536 (1999-03-01), Kumar et al.
patent: 07-099263 (1995-04-01), None
patent: 2000-176928 (2000-06-01), None

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