Method for manufacturing multilayer ceramic electronic element

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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C156S089140, C156S089160, C156S277000, C156S307500, C427S079000, C427S080000, C427S096100, C427S126200, C427S126300, C264S297400, C264S605000, C029S025420, C101S153000, C101S170000

Reexamination Certificate

active

07547370

ABSTRACT:
A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

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Official communication issued in the corresponding Japanese Patent Application No. 2002-006113, dated Aug. 22, 2006.
Official communication issued in the corresponding Japanese Patent Application No. 2001-381707, dated Feb. 28, 2006.

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