Method for manufacturing multilayer ceramic electronic...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

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Details

C156S089120, C156S060000, C156S230000, C156S241000, C156S247000, C156S256000, C156S310000, C428S688000

Reexamination Certificate

active

07828919

ABSTRACT:
A method for manufacturing a multilayer ceramic electronic component can prevent the occurrence of bubble trapping. In the method, when an external layer ceramic green sheet is pressure-bonded, for example, to a sheet made of a good quality paper having a rough surface, which is placed on a supporting member, followed by peeling off its carrier film, a first-layer ceramic green sheet is formed. The first-layer external layer ceramic green sheet uses a sterically hindered dispersing agent, such as an aryl ether polymer, as a dispersing agent. Since it is light in weight, the binder segregates at the upper side, and hence a C concentration changes in the thickness direction. More particularly, compared to a C concentration at a surface at a carrier film side supported by the carrier film, a C concentration at an open surface opposite to the surface at the carrier film side is about 1.5 to about 4.0 times.

REFERENCES:
patent: 3999004 (1976-12-01), Chirino et al.
patent: 5021287 (1991-06-01), Otagiri et al.
patent: 2006/0037690 (2006-02-01), Ishiyama et al.
patent: 01-125912 (1989-05-01), None
patent: 03-283496 (1991-12-01), None
patent: 03283496 (1991-12-01), None
patent: 06-231996 (1994-08-01), None
patent: 06231996 (1994-08-01), None
patent: 07-078725 (1995-03-01), None
patent: 08-055754 (1996-02-01), None
patent: 08055754 (1996-02-01), None
patent: 08316092 (1996-11-01), None
patent: 10-321457 (1998-12-01), None
patent: 10321457 (1998-12-01), None
patent: 11-111559 (1999-04-01), None
patent: 2001-307938 (2001-11-01), None
patent: 2001307938 (2001-11-01), None
patent: 2002-313672 (2002-10-01), None
patent: 2004-352552 (2004-12-01), None
patent: 2005-082437 (2005-03-01), None
patent: 2005067050 (2005-03-01), None
patent: 2005-191114 (2005-07-01), None
patent: 2007-123678 (2007-05-01), None
patent: 10-0884511 (2009-02-01), None
Official communication issued in the International Application No. PCT/JP2007/055626, mailed on Jul. 3, 2007.
Official Communication issued in corresponding Korean Patent Application No. 10-2008-7007265, mailed on Jan. 29, 2010.
Official Communication issued in corresponding Japanese Patent Application No. 2008-510821, mailed on May 18, 2010.
Official Communication issued in corresponding Korean Patent Application No. 2008-7007265, mailed on Jul. 28, 2010.

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