Method for manufacturing multi-layered ceramic electronic...

Details Method for manufacturing multi-layered ceramic electronic... Method for manufacturing multi-layered ceramic electronic...

2004-03-31

2009-02-17

Mayes, Melvin C. (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S089160, C156S235000, C156S239000, C156S289000

Reexamination Certificate

active

07491282

ABSTRACT:
It is an object of the present invention is to provide a method for manufacturing a multi-layered ceramic electronic component which can reliably prevent a multi-layered unit including a ceramic green sheet and an electrode layer from being damaged and efficiently laminate a desired number of the multi-layered units, thereby manufacturing the multi-layered ceramic electronic component.The method for manufacturing a multi-layered ceramic electronic component according to the present invention includes a step of laminating a plurality of multi-layered units each formed by laminating a release layer, an electrode layer and a ceramic green sheet on a support sheet in this order, the method further including steps of positioning the multi-layered unit on a base substrate so that the surface of the ceramic green sheet is contact with an agglutinant layer formed on the surface of the base substrate in such a manner that the bonding strength between itself and the support substrate is higher than the bonding strength between the support sheet and the release layer and lower than the bonding strength between itself and the ceramic green sheet, pressing it and laminating multi-layered units on the base substrate.

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